发明名称 CURABLE RESIN COMPOSITIONS
摘要 A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged.
申请公布号 WO2013025304(A3) 申请公布日期 2013.08.22
申请号 WO2012US47146 申请日期 2012.07.18
申请人 DOW GLOBAL TECHNOLOGIES LLC;PADILLA-ACEVEDO, ANGELA I.;VALETTE, LUDOVIC;MULLINS, MICHAEL J.;VERGHESE, KANDATHIL E.;WILSON, MARK B. 发明人 PADILLA-ACEVEDO, ANGELA I.;VALETTE, LUDOVIC;MULLINS, MICHAEL J.;VERGHESE, KANDATHIL E.;WILSON, MARK B.
分类号 C08G59/02;C08G59/24;C08G59/50;C08G59/56;C08J5/24 主分类号 C08G59/02
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