| 摘要 |
PROBLEM TO BE SOLVED: To provide a primer layer for a plating process, which exhibits high adhesiveness with electroless copper plating and is available for wiring-densification of a semiconductor package; to provide a laminate for a circuit board having the primer layer and a method for producing the laminate; and to provide a multilayer circuit board having the primer layer and a method for producing the multilayer circuit board.SOLUTION: There are provided a primer layer for a plating process, formed by a primer layer resin composition including a polyfunctional epoxy resin (A), an epoxy resin curing agent (B), and a polybutadiene-modified polyamide resin (C) containing phenolic hydroxyl groups having a predetermined structural unit, wherein the blend ratio of component (C) is not less than 5 pts.mass and less than 25 pts.mass based on 100 pts.mass in total of component (A) and component (B); a laminate for circuit boards having the primer layer, and a method for producing the laminate; and a multilayer circuit board having the primer layer, and a method for producing the multilayer circuit board. |
