MANUFACTURING METHOD OF PIEZOELECTRIC DEVICE, PIEZOELECTRIC DEVICE AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a piezoelectric device that improves bonding strength between a cap type lid body and a base substrate by laser beam irradiation and further enhances airtightness of an accommodation space of a piezoelectric element.SOLUTION: There is provided a manufacturing method of a piezoelectric device comprising: a piezoelectric element 20; a base substrate 30 on which the piezoelectric element 20 is mounted; a recessed portion 41 for inwardly covering the piezoelectric element 20; and a cap type lid body 40 having a flange 42 which surrounds a periphery of the recessed portion 41 and is bonded to the base substrate 30. The manufacturing method of the piezoelectric device comprises the steps of: forming metallized wiring 36 at a joint portion of the base substrate 30 bonded to the lid body 40; bringing the flange 42 into contact with the metallized wiring 36 via a bonding material 50; and irradiating the flange 42 with a laser beam such that an irradiation axis of the laser beam is parallel to and along a side wall surface of the lid body 40 and bonding the flange 42 and the metallized wiring 36.