| 摘要 |
PROBLEM TO BE SOLVED: To perform predetermined processing and conveyance while securely holding a wafer when processing both surfaces of the wafer in order.SOLUTION: After a first fixing tool 3a is fixed in contact with one surface of a wafer and the other surface is processed as predetermined, a second fixing tool 3b is fixed in contact with the other surface of the wafer, the first fixing tool 3a is separated, and the wafer is delivered to the second fixing tool 3b. Both the fixing tools each comprise a tool body 31 and a contact layer 32 provided to one surface thereof. The tool body has a plurality of support projections 33 supporting the contact layer and a side wall 34, the contact surface is brought into contact with an end face of the side wall to define a sectioned space 35 surrounded with the side wall between the contact layer and the tool body, and an air vent 36 communicating with the sectioned space is formed to deform the contact layer by sucking air in the sectioned space. During separation, the contact layer of the first fixing tool is deformed to move both the fixing tools relatively away from each other. |
