发明名称 MANUFACTURING METHOD OF PRINTED WIRING BOARD AND PRINTED WIRING BOARD
摘要 Object of the present invention is to provide a method for manufacturing a printed wiring board which enables fine wiring formation at low costs and with high yields without introducing any special equipment, and a printed wiring board manufactured by the method. To achieve the object, a method for forming the wiring pattern adopted includes steps; for forming a laminate having a structure in which a copper foil layer formed using copper foil without roughening treatment having surface roughness (Rzjis) at a bonding surface of 2 mum or less and thickness of 5 mum or less is laminated to a conductive layer via an insulating layer; for providing a blind-hole composed of a hole perforating the copper foil layer and the insulating layer; and a bottom composed of the conductive layer in the laminate; for filling-up the blind-hole by a electro-plated copper in the time for depositing an electro-plated copper layer on a surface of the electroless-plated copper layer to make the total thickness of a copper layer provided on the insulating layer 15 mum or less, for providing of an etching resist layer having thickness of 15 mum or less and for etching of the copper layer.
申请公布号 US2013213701(A1) 申请公布日期 2013.08.22
申请号 US201113813678 申请日期 2011.07.28
申请人 IIDA HIROTO;MITSUI MINING & SMELTING CO., LTD. 发明人 IIDA HIROTO
分类号 H05K3/06;H05K1/02 主分类号 H05K3/06
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