PACKAGE FOR OPTICAL SEMICONDUCTOR DEVICE AND METHOD THEREOF, OPTICAL SEMICONDUCTOR DEVICE AND METHOD THEREOF

摘要

PURPOSE: A package for an optical semiconductor device, the optical semiconductor device, and manufacturing methods thereof are provided to make the optical semiconductor device with high durability and low noises possible by using a base obtained by impregnating silicon resin compounds into a fiber reinforcement material and hardening the silicon resin compounds. CONSTITUTION: At least two electrical connection units (3) are electrically connected to an optical semiconductor device on the upper side of a base. The electrical connection unit is composed of at least one metal layer. The base is formed by impregnating silicon resin compounds into a three-layered fiber reinforcement material. A metal coating layer is formed on the lower side of the base. A reflector structure (6) surrounds the connected optical semiconductor device.