发明名称 |
ELECTROLESS COPPER AND REDOX COUPLE |
摘要 |
PROBLEM TO BE SOLVED: To provide an electroless copper bath which is free of formaldehyde and is stable, provides acceptable copper deposits and is environmentally friendly.SOLUTION: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates. |
申请公布号 |
JP2013163867(A) |
申请公布日期 |
2013.08.22 |
申请号 |
JP20130103977 |
申请日期 |
2013.05.16 |
申请人 |
ROHM & HAAS ELECTRONIC MATERIALS LLC |
发明人 |
POOLE MARK A;COBLEY ANDREW J;SINGH AMRIK;HIRST DEBORAH V |
分类号 |
C23C18/40;H05K3/18;H05K3/42 |
主分类号 |
C23C18/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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