发明名称 ELECTROLESS COPPER AND REDOX COUPLE
摘要 PROBLEM TO BE SOLVED: To provide an electroless copper bath which is free of formaldehyde and is stable, provides acceptable copper deposits and is environmentally friendly.SOLUTION: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.
申请公布号 JP2013163867(A) 申请公布日期 2013.08.22
申请号 JP20130103977 申请日期 2013.05.16
申请人 ROHM & HAAS ELECTRONIC MATERIALS LLC 发明人 POOLE MARK A;COBLEY ANDREW J;SINGH AMRIK;HIRST DEBORAH V
分类号 C23C18/40;H05K3/18;H05K3/42 主分类号 C23C18/40
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