| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for a printed wiring board especially excellent in low thermal expansion without the need of high filling of an inorganic filler or enhanced crosslink density of the resin composition; and a prepreg, a laminate, and a wiring board using the same.SOLUTION: A low thermally-expandable resin composition includes an epoxy resin (A) having polycyclic structure, a phosphorus compound (B) represented by chemical formula (I), and dicyandiamide (C), wherein an epoxy resin (E1), which is obtained when 0.005-0.05 mol of the phosphorus compound (B) represented by chemical formula (I) is blended or preliminary reacted with 1 mol of an epoxy group of the epoxy resin (A) having polycyclic structure, is contained. |
