发明名称 POLISHING PAD AND METHOD OF MANUFACTURING THE SAME
摘要 Polishing pad and method of manufacturing the same, the method including: (a) mixing materials for forming a polishing layer; (b) mixing at least two from among inert gas, a capsule type foaming agent, a chemical foaming agent, and liquid microelements that are capable of controlling sizes of pores, with the mixture in (a) so as to form two or more types of pores; (c) performing gelling and hardening of the mixture generated in (b) so as to form a polishing layer including the two or more types of pores; and (d) processing the polishing layer so as to distribute micropores defined by opening the two or more types of pores on a surface of the polishing layer.
申请公布号 US2013212951(A1) 申请公布日期 2013.08.22
申请号 US201313761338 申请日期 2013.02.07
申请人 KPX CHEMICAL CO., LTD.;SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD.;KPX CHEMICAL CO., LTD. 发明人 AHN BONG-SU;JANG YOUNG-JUN;LEE SANG-MOK;CHUNG HWI-KUK;SONG KEE-CHEON;KIM SEUNG-GEUN;SEO JANG-WON;CHOO JEONG-SEON
分类号 B24D3/32 主分类号 B24D3/32
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