发明名称 |
High Current, Low Equivalent Series Resistance Printed Circuit Board Coil for Power Transfer Application |
摘要 |
A method for fabricating an electric coil on a circuit board comprising fabricating on the circuit board a first coil layer comprising a coil trace and a plurality of vias distributed along the length of the coil trace, and overlaying a second coil layer on the first coil layer, wherein the vias of the first coil layer join the first coil layer and the second coil layer.
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申请公布号 |
US2013214890(A1) |
申请公布日期 |
2013.08.22 |
申请号 |
US201213535059 |
申请日期 |
2012.06.27 |
申请人 |
ZABACO JORGE;FUTUREWEI TECHNOLOGIES, INC. |
发明人 |
ZABACO JORGE |
分类号 |
H05K3/42;H01F5/00;H01F41/04;H04B5/00 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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