| 摘要 |
A device for monitoring the extent of cure of an adhesive located between at least two components. The device includes a data logger operably connected to at least one of the components, and configured to record data related to time and temperature, obtaining a thermal history data of the component during a heating process. An algorithm, installed in the data logger, processes the thermal history data of the component. A kinetic cure model is included in the algorithm calculating and predicting an extent of adhesive cure according to the processed thermal history. The device further includes a visual display operably connected to the data logger and configured to indicate the extent of adhesive cure. |
