发明名称 SUBSTRATE JOINT STRUCTURE, RADIO DEVICE INCLUDING SUBSTRATE JOINT STRUCTURE, AND SUBSTRATE JOINT METHOD USING SUBSTRATE JOINT STRUCTURE
摘要 PROBLEM TO BE SOLVED: To improve the flexibility of the positioning between an attachment member and a printed wiring board and reduce the occurence of joint defects between the attachment member and the printed wiring board.SOLUTION: A substrate joint structure includes: an attachment member 20 including a metal pin 26 where a flange is formed at a tip thereof; a printed wiring board 30 where a cutout part 31 is formed at a part of an outer periphery and a copper foil 32 is formed on a plate surface around at least the cutout part; and a support member supporting the attachment member and the printed wiring board with the metal pin of the attachment member intersecting with the plate surface of the printed wiring board. An outer peripheral surface of the flange in the metal pin of the attachment member is joined to the copper foil of the printed wiring board.
申请公布号 JP2013164973(A) 申请公布日期 2013.08.22
申请号 JP20120027369 申请日期 2012.02.10
申请人 OKI ELECTRIC IND CO LTD 发明人 MATSUMOTO SATOSHI
分类号 H01R24/50;H01R13/73;H01R24/52;H01R43/00;H05K1/18;H05K3/34 主分类号 H01R24/50
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