| 摘要 |
PROBLEM TO BE SOLVED: To provide an aggregate substrate suitable for multi-piece chip resistors in which imperfect contact of a probe is less likely to occur, and to provide a manufacturing method of a chip resistor using the aggregate substrate.SOLUTION: On the front and back principal surfaces of an aggregate substrate 10, as rectangular regions sectioned by split grooves 11, 12 of lattice shape, a plurality of adjoining first chip regions A1 and second chip regions A2 of the same size are arranged, so that the chip regions A1 of one principal surface and the chip regions A2 of the other principal surface have a positional relation corresponding on the front and back. A pair of front surface electrodes 3a being bridged to a resistor 5 are provided at both ends of each first chip region A1 in the longitudinal direction, and a pair of back surface electrodes 3b are provided at both ends of each second chip region A2 in the longitudinal direction. The front surface electrodes 3a and the back surface electrodes 3b in the chip regions A1, A2 adjoining via the split groove 11 are continuous. When forming a trimming groove 8, resistance is measured by touching a probe 20 to an electrode pattern 3 including both electrodes 3a, 3b. |
