| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin composition for sealing a semiconductor, which is excellent in balance among flowability, fracture toughness value and elastic modulus, and to provide a semiconductor device using the same, which is excellent in reflow resistance and thereby high in connection reliability during a heat cycle test.SOLUTION: A liquid resin composition for sealing a semiconductor includes an epoxy resin (A), an amine-based curing agent (B), and an inorganic filler (C). The epoxy resin (A) contains an epoxy resin (A1) which is liquid at 25°C and an aromatic glycidylamine-type epoxy resin (A2), the content of the inorganic filler (C) is 30 to 75 wt.%, and the fracture toughness value of a cured material of the liquid resin composition is 2.0 to 3.5 MPa-m0.5. |
