METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENT, AND SUBSTRATE WITH BUILT-IN COMPONENT MANUFACTURED USING THE METHOD

摘要

A thin-film conductive layer to be a conductor pattern (18) is prepared, a mask layer (3) is formed on the conductive layer except at a plurality of actual connecting positions and at least one dummy connecting position, an actual solder pad (6) and a dummy solder pad (7) are respectively formed using a solder at each of the actual connecting positions exposed from the conductive layer, and at the dummy connecting position, and the connecting terminal (9) of an electric or electronic component (8) is connected to the actual solder pad (6). A resin insulating base material (16) is formed, said insulating base material being laminated on the conductive layer directly or with the mask layer (3) therebetween, and having the component (8) embedded therein, a part of the conductive layer is removed with the dummy solder pad (7) as reference, and the conductor pattern (18) is formed.