发明名称 |
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A SEMICONDUCTOR MODULE |
摘要 |
An exemplary semiconductor module includes a substrate formed of a ceramic insulator, and at least one metallic layer formed on the substrate. The metallic layer includes a deepening for placing and fixing a contact element. The contact element is at least partially "L"-shaped and includes a first arm for fixing the contact element at the deepening, and a second arm for interconnecting the contact element with an external device. The deepening has a horizontal dimension which is about @0.5 mm bigger than the horizontal dimension of the contact element. |
申请公布号 |
EP2628173(A2) |
申请公布日期 |
2013.08.21 |
申请号 |
EP20110764780 |
申请日期 |
2011.10.07 |
申请人 |
ABB RESEARCH LTD. |
发明人 |
SCHULZ, NICOLA;HARTMANN, SAMUEL |
分类号 |
H01L21/60;H01L23/00;H01L23/498;H01L23/538;H05K1/11;H05K3/32 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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