发明名称 Metallization process of non-conductive polymer substrates using wet surface treatment technology
摘要 A metallization method of a surface of a non-conductive polymer material using wet surface treatment technology and a polymer film prepared by the metallization method are provided to form a uniform metal film on the surface of the polymer material, enable one or both faces of the polymer material to be subjected to a metallization treatment process, and expect to improve economic efficiency and productivity by a batch process. A metallization method of a surface of a non-conductive polymer material comprises: a first step of proceeding degreasing and cleaning processes to remove contaminants from the polymer material; a second step of proceeding a surface modification process to impart a functional group to the polymer material and impart roughness onto a surface of the polymer material; a third step of proceeding a catalytic treatment process and an activating process to adsorb precious metal particles onto the surface of the polymer material and reduce the precious metal particles into metal particles; and a fourth step of proceeding an electroless plating process to form a final metal film layer. The metallization method further comprises a fifth step of proceeding an electroplating process after the fourth step.
申请公布号 KR101298746(B1) 申请公布日期 2013.08.21
申请号 KR20060096242 申请日期 2006.09.29
申请人 发明人
分类号 C23C18/16;C23C18/54;C23C28/00 主分类号 C23C18/16
代理机构 代理人
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