发明名称 |
MANUFACTURING METHOD FOR FLEXIBLE DEVICE AND FLEXIBLE DEVICE MANUFACTURED BY THE SAME |
摘要 |
<p>PURPOSE: A method for manufacturing a flexible device and the flexible device are provided to maintain a flexible substrate with a high alignment by bonding the flexible device to the flexible substrate after the flexible device is manufactured on a silicon substrate. CONSTITUTION: A silicon-on-insulator includes a bottom silicon layer, an insulation layer (200), and a top silicon layer (100). A device (300) is arranged on the top silicon layer. A second silicon substrate is bonded to the top silicon layer through a bonding layer. The bottom silicon layer is removed. The top silicon layer is transferred on a flexible substrate (600) by using the second silicon substrate. A passivation layer is laminated on the flexible substrate.</p> |
申请公布号 |
KR20130092706(A) |
申请公布日期 |
2013.08.21 |
申请号 |
KR20120014138 |
申请日期 |
2012.02.13 |
申请人 |
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
LEE, KEON JAE;LEE, KWY RO;HWANG, GEON TAE;IM, DONG GU |
分类号 |
H01L21/027;H01L27/12 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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