| 摘要 |
<p>A loudspeaker array element with an internal rigid structural frame and at least one interface for attaching one or more of enclosures, rigging components, waveguides, sound chambers, transducers and electronics to the frame is provided. Further configurations are provided for heat sinking of electrically powered devices such as loudspeakers, as well as power amplifiers, digital signal processing and networking hardware.</p> |
