发明名称 |
HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET |
摘要 |
<p>An object is to provide a heat conductive adhesive composition containing boron nitride particles and an acrylic polymer, which is capable of forming a molding having a good heat conductivity, and a heat conductive adhesive sheet with the heat conductive adhesive composition therein, which has a good heat conductivity and bond strength. Provided is the heat conductive adhesive composition which contains boron nitride particles and an acrylic polymer component, and the above boron nitride particles contain boron nitride particles having a particle size of 3 µm or more and 300 µm or less, wherein the boron nitride particles contain 5 to 45% by volume of boron nitride particles having a particle size of 3 µm or more and 20 µm or less, 30 to 70% by volume of boron nitride particles having a particle size of more than 20 µm and 60 µm or less, 10 to 40% by volume of boron nitride particles having a particle size of more than 60 µm and 300 µm or less.</p> |
申请公布号 |
EP2392628(B1) |
申请公布日期 |
2013.08.21 |
申请号 |
EP20100735700 |
申请日期 |
2010.01.13 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
NAKAYAMA, JUNICHI;TERADA, YOSHIO;FURUTA, KENJI;WANO, TAKASHI |
分类号 |
C09J133/00;C08K3/38;C09J7/00;C09J7/02;C09J11/04;C09J133/08 |
主分类号 |
C09J133/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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