发明名称 ALUMINUM BASE PLATE FOR POWER MODULE
摘要 PURPOSE: An aluminum base plate for a power module is provided to reduce the weight and costs of the power module by using aluminum for a base plate. CONSTITUTION: A direct bonded copper (DBC) substrate (20) is combined with a power switching device (10) by a soldering operation. An aluminum base plate (30) is combined with the DBC substrate by the soldering operation. The aluminum base plate is composed of a top copper layer (32), an aluminum layer (31), and a bottom copper layer (33). A heat sink (40) receives heat from the power switching device through the DBC substrate and the aluminum base plate. The aluminum base plate is integrated with the heat sink.
申请公布号 KR20130092678(A) 申请公布日期 2013.08.21
申请号 KR20120014090 申请日期 2012.02.13
申请人 AUK CORP. 发明人 LEE, JUNG BOONG
分类号 H01L23/12;H01L23/48 主分类号 H01L23/12
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