| 摘要 |
A heat dissipation structure has a base 10, a light emission module 20, a heat dissipation module 30, and a control circuit module 40. The base 10 has two ends forming an electrical connector section 12 and an open cavity 13. The light emission module 20 has a substrate 21 mounted in the open cavity 13 and a plurality of light emission elements 22 mounted on the substrate 21. The heat dissipation module 30 has a plurality of heat dissipation plates 31 stacked on the substrate 21 to form a concentrated heat dissipation zone 30a. Each heat dissipation plate 31 has a circumference forming a plurality of included side wing sections 33. The side wing sections 33 of different heat dissipation plates 31 have different inclination angles and form an expanded heat dissipation zone 30b. The control circuit module 40 is received in the base 10 and is electrically connected to the substrate 21 and the electrical connector section 12. |
