发明名称
摘要 <p>A semiconductor device according to an embodiment includes a semiconductor substrate of a first conductivity type, a first semiconductor layer of the first conductivity type, a first semiconductor region of a second conductivity type, a second semiconductor region of the second conductivity type, a first electrode and a second electrode. The first semiconductor region is formed on at least a part of the first semiconductor layer formed on the semiconductor substrate. The second semiconductor region is formed on another part of the first semiconductor layer to reach an inside of the first semiconductor layer and having an impurity concentration higher than that of the first semiconductor region. The first electrode is formed on the second semiconductor region and a third semiconductor regions formed in a part of the first semiconductor region. The second electrode is formed to be in contact with a rear surface of the semiconductor substrate.</p>
申请公布号 JP5269015(B2) 申请公布日期 2013.08.21
申请号 JP20100201452 申请日期 2010.09.08
申请人 发明人
分类号 H01L29/861;H01L29/868 主分类号 H01L29/861
代理机构 代理人
主权项
地址