| 摘要 |
PROBLEM TO BE SOLVED: To improve mechanical strength of a microelectromechanical device (MEMS) having a movable part, and improve a yield ratio and reliability. SOLUTION: In the microelectromechanical device (MEMS) having the movable part, a filling material is filled in a portion which is a hollow part in a conventional microelectromechanical device. An insulating material with elasticity is used for the filling material. For example, elastomer is used as an insulating material with elasticity. As the hollow part is filled, the mechanical strength is improved. Further, warpage of a structural body in a manufacturing process is prevented to improve the yield ratio. As the microelectromechanical device is manufactured in this way, reliability of the same is improved. COPYRIGHT: (C)2009,JPO&INPIT |
