发明名称 Cerium oxide abrasive and method of polishing substrates
摘要 <p>This invention relates to a cerium oxide abrasive and a method of polishing substrates. The present invention provides a cerium oxide 1 abrasive that can polish the surfaces of objects such as SiO 2 insulating films without causing scratches and at a high rate, and also provides a method of polishing substrates.</p>
申请公布号 EP1833084(B1) 申请公布日期 2013.08.21
申请号 EP20070109339 申请日期 1997.09.30
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 YOSHIDA, MASATO;ASHIZAWA, TORANOSUKE;TERASAKI, HIROKI;KURATA, YASUSHI;MATSUZAWA, JUN;TANNO, KIYOHITO;OOTUKI, YUUTO
分类号 H01L21/304;B24B37/00;C09C1/68;C09G1/02;C09K3/14;H01L21/3105;H01L21/321 主分类号 H01L21/304
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