发明名称 |
Semiconductor device having a buried insulating layer and method of manufacturing the same |
摘要 |
<p>There is provided a semiconductor device in which the degradation of electric characteristics can be inhibited. A semiconductor substrate (SUB) has a main surface, and a trench (TR) in the main surface. A buried insulating film (Bi) is buried in the trench. The trench has one wall surface (FS) and the other wall surface (SS) which oppose each other. A gate electrode layer (GE) is located over at least the buried insulating film. The trench has angular portions (CP1A,CP2A) which are located between the main surface of at least either one of the one wall surface and the other wall and a bottom portion (BT) of the trench.
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申请公布号 |
EP2244300(A3) |
申请公布日期 |
2013.08.21 |
申请号 |
EP20100250552 |
申请日期 |
2010.03.23 |
申请人 |
RENESAS ELECTRONICS CORPORATION |
发明人 |
YANAGI, SHINICHIRO |
分类号 |
H01L29/78;H01L21/336;H01L21/8234;H01L21/8247;H01L27/088;H01L27/115;H01L29/06;H01L29/08;H01L29/40;H01L29/423;H01L29/8605 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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