发明名称 Semiconductor device having a buried insulating layer and method of manufacturing the same
摘要 <p>There is provided a semiconductor device in which the degradation of electric characteristics can be inhibited. A semiconductor substrate (SUB) has a main surface, and a trench (TR) in the main surface. A buried insulating film (Bi) is buried in the trench. The trench has one wall surface (FS) and the other wall surface (SS) which oppose each other. A gate electrode layer (GE) is located over at least the buried insulating film. The trench has angular portions (CP1A,CP2A) which are located between the main surface of at least either one of the one wall surface and the other wall and a bottom portion (BT) of the trench. </p>
申请公布号 EP2244300(A3) 申请公布日期 2013.08.21
申请号 EP20100250552 申请日期 2010.03.23
申请人 RENESAS ELECTRONICS CORPORATION 发明人 YANAGI, SHINICHIRO
分类号 H01L29/78;H01L21/336;H01L21/8234;H01L21/8247;H01L27/088;H01L27/115;H01L29/06;H01L29/08;H01L29/40;H01L29/423;H01L29/8605 主分类号 H01L29/78
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