发明名称 |
Multi-die semiconductor package with one or more embedded die pads |
摘要 |
To avoid shorts between adjacent die pads in mounting a multi-die semiconductor package to a printed circuit board (PCB), one of the die pads is embedded in the polymer capsule, while the other die pad is exposed at the bottom of the package to provide a thermal escape path to the PCB. This arrangement is particularly useful when one of the dice in a multi-die package generates more heat than another die in the package.
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申请公布号 |
US8513787(B2) |
申请公布日期 |
2013.08.20 |
申请号 |
US201113210841 |
申请日期 |
2011.08.16 |
申请人 |
WILLIAMS RICHARD K.;LIN KENG HUNG;ADVANCED ANALOGIC TECHNOLOGIES, INCORPORATED |
发明人 |
WILLIAMS RICHARD K.;LIN KENG HUNG |
分类号 |
H01L23/495;H01L23/48 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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