发明名称 |
MEMS integrated chip and method for making same |
摘要 |
The present invention discloses a MEMS (Micro-Electro-Mechanical System) chip and a method for making the MEMS chip. The MEMS chip comprises: a first substrate having a first surface and a second surface opposing each other; a microelectronic device area on the first surface; a first MEMS device area on the second surface; and a conductive interconnection structure electrically connecting the microelectronic device area and the first MEMS device area. |
申请公布号 |
US8513041(B2) |
申请公布日期 |
2013.08.20 |
申请号 |
US20090627480 |
申请日期 |
2009.11.30 |
申请人 |
WANG CHUAN-WEI;LEE SHENG-TA;HSU HSIN-HUI;WANG WEI-CHUNG;PIXART IMAGING CORPORATION |
发明人 |
WANG CHUAN-WEI;LEE SHENG-TA;HSU HSIN-HUI;WANG WEI-CHUNG |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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