发明名称 MEMS integrated chip and method for making same
摘要 The present invention discloses a MEMS (Micro-Electro-Mechanical System) chip and a method for making the MEMS chip. The MEMS chip comprises: a first substrate having a first surface and a second surface opposing each other; a microelectronic device area on the first surface; a first MEMS device area on the second surface; and a conductive interconnection structure electrically connecting the microelectronic device area and the first MEMS device area.
申请公布号 US8513041(B2) 申请公布日期 2013.08.20
申请号 US20090627480 申请日期 2009.11.30
申请人 WANG CHUAN-WEI;LEE SHENG-TA;HSU HSIN-HUI;WANG WEI-CHUNG;PIXART IMAGING CORPORATION 发明人 WANG CHUAN-WEI;LEE SHENG-TA;HSU HSIN-HUI;WANG WEI-CHUNG
分类号 H01L21/00 主分类号 H01L21/00
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