发明名称 |
Semiconductor device and method for manufacturing same |
摘要 |
A semiconductor device includes: a substrate made of silicon carbide and having a main surface having an off angle of not less than -3° and not more than +5° relative to a (0-33-8) plane in a <01-10> direction; a p type layer made of silicon carbide and formed on the main surface of the substrate by means of epitaxial growth; and an oxide film formed in contact with a surface of the p type layer. A maximum value of nitrogen atom concentration is 1×1021 cm-3 or greater in a region within 10 nm from an interface between the p type layer and the oxide film.
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申请公布号 |
US8513676(B2) |
申请公布日期 |
2013.08.20 |
申请号 |
US201013512459 |
申请日期 |
2010.12.17 |
申请人 |
HARADA SHIN;HIYOSHI TORU;WADA KEIJI;MASUDA TAKEYOSHI;SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
HARADA SHIN;HIYOSHI TORU;WADA KEIJI;MASUDA TAKEYOSHI |
分类号 |
H01L29/38 |
主分类号 |
H01L29/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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