发明名称 Semiconductor device and method of manufacturing the same, and electronic apparatus
摘要 A semiconductor device comprising a first semiconductor section including a first wiring layer at one side thereof, a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together with the respective first and second wiring layer sides of the first and second semiconductor sections facing each other, a conductive material extending through the first semiconductor section to the second wiring layer of the second semiconductor section and by means of which the first and second wiring layers are in electrical communication.
申请公布号 US8514308(B2) 申请公布日期 2013.08.20
申请号 US20100962854 申请日期 2010.12.08
申请人 ITONAGA KAZUICHIRO;HORIIKE MACHIKO;SONY CORPORATION 发明人 ITONAGA KAZUICHIRO;HORIIKE MACHIKO
分类号 H04N3/14;H01L23/52;H04N5/225 主分类号 H04N3/14
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