| 摘要 |
PURPOSE: A chemical-mechanical polishing detergent composition, and a cleaning method using the same are provided to remove an organic material pollution layer on the copper surface in a cleaning process after a copper chemical-mechanical polishing process, and to obtain an oxide film which is maintained stably until a subsequent process. CONSTITUTION: A liquid detergent composition comprises: an organic solvent comprising KOH or/and TMAH; a chelate reagent comprising EDTA and/or arginine; an anticorrosive agent; and pure water. To the total amount of the liquid detergent composition, the organic solvent, chelate reagent, and anticorrosive agent are comprised in a ratio of 1-10 wt%, 1-10 wt%, and 0.2-2 wt%respectively. A cleaning method of a copper chemical-mechanical polishing process comprises the steps of: polishing the surface of copper chemical-mechanically; and cleaning the polished copper surface using the liquid detergent composition. [Reference numerals] (AA) Example 2-1 |
