发明名称 |
Integrated circuit packaging system with pad and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, and a peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side; forming a first top distribution layer on the peripheral lead top side; connecting an integrated circuit to the first top distribution layer; and applying an insulation layer directly on a distribution layer bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge with a cavity in the portion of the insulation layer directly below the integrated circuit.
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申请公布号 |
US8513788(B2) |
申请公布日期 |
2013.08.20 |
申请号 |
US201113326173 |
申请日期 |
2011.12.14 |
申请人 |
DO BYUNG TAI;TRASPORTO ARNEL SENOSA;CHUA LINDA PEI EE;STATS CHIPPAC LTD. |
发明人 |
DO BYUNG TAI;TRASPORTO ARNEL SENOSA;CHUA LINDA PEI EE |
分类号 |
H01L23/495;H01L21/00 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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