发明名称 Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers
摘要 A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner and an outer gear wheel or pin ring, wherein the gear wheels or pin rings have a multiplicity of gear or pin arrangements which engage the teeth of the carrier discs during rolling, at least one of the pin arrangements having a guide which delimits movement of the margin of the carrier disc in at least one axial direction, the guide formed by a circumferential shoulder or a circumferential groove.
申请公布号 US8512099(B2) 申请公布日期 2013.08.20
申请号 US20090581195 申请日期 2009.10.19
申请人 KERSTAN MICHAEL;PIETSCH GEORG;RUNKEL FRANK;BECHTOLSHEIM CONRAD VON;MOELLER HELGE;SILTRONIC AG;PETER WOLTERS GMBH 发明人 KERSTAN MICHAEL;PIETSCH GEORG;RUNKEL FRANK;BECHTOLSHEIM CONRAD VON;MOELLER HELGE
分类号 B24B1/00;B24B37/08 主分类号 B24B1/00
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