发明名称 |
Single-layer metallization and via-less metamaterial structures |
摘要 |
Techniques and apparatus based on metamaterial structures provided for antenna and transmission line devices, including single-layer metallization and via-less metamaterial structures.
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申请公布号 |
US8514146(B2) |
申请公布日期 |
2013.08.20 |
申请号 |
US20080250477 |
申请日期 |
2008.10.13 |
申请人 |
GUMMALLA AJAY;ACHOUR MAHA;LEE CHENG-JUNG;PATHAK VANEET;POILASNE GREGORY;TYCO ELECTRONICS SERVICES GMBH |
发明人 |
GUMMALLA AJAY;ACHOUR MAHA;LEE CHENG-JUNG;PATHAK VANEET;POILASNE GREGORY |
分类号 |
H01Q15/02 |
主分类号 |
H01Q15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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