发明名称 |
Semiconductor package and method of manufacturing the same |
摘要 |
A light-emitting device package including a lead frame formed of a metal and on which a light-emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding. The lead frame includes: a mounting portion on which the light-emitting device chip is mounted; and first and second connection portions that are disposed on two sides of the mounting portion in a first direction and connected to the light-emitting device chip by wire bonding, wherein the first connection portion is stepped with respect to the mounting portion, and a stepped amount is less than a material thickness of the lead frame.
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申请公布号 |
US8513680(B2) |
申请公布日期 |
2013.08.20 |
申请号 |
US201113234971 |
申请日期 |
2011.09.16 |
申请人 |
KIM DANIEL;YOU JAE-SUNG;PARK JONG-KIL;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM DANIEL;YOU JAE-SUNG;PARK JONG-KIL |
分类号 |
H01L27/15;H01L31/12;H01L33/00 |
主分类号 |
H01L27/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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