| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition that can form a coating film that maintains a high thixotropic ratio even after a long period of time following preparation to prevent occurrence of sags and is excellent in solder heat resistance and finished appearance.SOLUTION: A curable resin composition contains (A) carboxyl group-containing photosensitive resin, (B) photoinitiator, (C) diluent, (D) epoxy compound, and (E) organic phosphate. |
