| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting diode element with a wavelength conversion layer which can prevent the eutectic bonding from failing in connecting a substrate.SOLUTION: A light-emitting diode element 2 has semiconductor stacking layers 22, 24, 26, and electrodes 28 are bonded with a base 12. A side wall 7 of the light-emitting diode element 2 has an upper surface 8 and a lower surface 10, and the lower surface 10 is closer to the base 12 than the upper surface 8 is. A wavelength conversion layer 4 covers only a top surface 6 of the light-emitting diode element 2 and the upper surface 8, and does not cover the lower surface 10. |
