| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can release heat generated by a semiconductor laser element with high efficiency and inhibit thermal strain occurring in a chip.SOLUTION: A semiconductor device of a present embodiment is a semiconductor device in which a chip having a plurality of semiconductor laser elements is provided in a submount structure. The submount structure includes a base substrate and a diamond layer which is formed on a surface of the base substrate and divided into multiple support elements along the surface of the base substrate. The chip is fixed on the diamond layer. |
