| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which improves connection accuracy between a relatively fine wiring layer formed on a surface of a ceramic layer and a through conductor which is connected to the wiring layer at one end and which pierces the ceramic layer.SOLUTION: A wiring board manufacturing method comprises: a process of forming a broad-area conductor layer Pf on a surface f1 of a green sheet g1 having the surface f1 and a rear face f2; a process of forming a through hole h which pierces the green sheet g1 from the surface f1 to the rear face f2, and the broad-area conductor layer Pf; a process of forming a through conductor v by filling a conductive paste in the through hole h; and a process of subsequently performing laser processing L on the broad-area conductor layer Pf from above the surface f1 of the green sheet g1 and removing a conductor at a predetermined position thereby to form a wiring layer 3 of a predetermined pattern including the through hole h and the through conductor v. The laser processing L in the process of forming the wiring layer 3 is performed with reference to either an end edge 2 of the through hole h or a circumference 2 of an end face of the through conductor v. |
