发明名称 SUBSTRATE PROCESSING DEVICE, COATING DEVELOPMENT DEVICE WITH THE SAME, AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To easily exhaust liquid from spacers of a pattern formed on a substrate.SOLUTION: The substrate processing device comprises: a substrate holding section capable of holding a substrate and rotating the substrate with a center of the substrate as a rotation center; a rinse liquid supply section that can move in a direction toward an outer edge from the center of the substrate rotated by the substrate holding section and supply rinse liquid to a surface of the substrate; and a first inactive gas supply section that can move toward the outer edge from the center of the substrate together with the rinse liquid supply section, and supply inactive gas to the surface of the substrate rotated by the substrate holding section from a supply direction inclined from a direction vertical to the surface of the substrate and displaced to a downstream side in a rotation direction of the substrate from a radial direction of the substrate.
申请公布号 JP2013162040(A) 申请公布日期 2013.08.19
申请号 JP20120024381 申请日期 2012.02.07
申请人 TOKYO ELECTRON LTD 发明人 YOSHIDA YUICHI;YOSHIHARA KOSUKE;IZEKI TOSHIHIRO
分类号 H01L21/027;G03F7/30;H01L21/304 主分类号 H01L21/027
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