发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE, ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To mount a lead type electronic component efficiently with high precision.SOLUTION: The electronic component mounting device for transferring an electronic component at a holding position to the mounting position of a circuit board by means of a head moving on a horizontal plane and mounting the electronic component comprises: a radial lead type electronic component feeding device for loading a plurality of radial lead type electronic components; and an electronic component holding tape having a tape body holding the plurality of radial lead type electronic components, cutting the leads of the radial lead type electronic components held by the electronic component holding tape short to a predetermined length, and separating the radial lead type electronic components from the tape body before being supplied to the holding positions; a head body having a suction nozzle or a holding nozzle, a nozzle drive section for vertically driving and rotary driving while mounting the nozzle and supplying pneumatic pressure; and a head support for supporting the nozzle and the nozzle drive section.
申请公布号 JP2013162102(A) 申请公布日期 2013.08.19
申请号 JP20120025612 申请日期 2012.02.08
申请人 JUKI CORP 发明人 ITO NAOYA
分类号 H05K13/04 主分类号 H05K13/04
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