| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, in a joint part between a semiconductor module and a cooler, a semiconductor element having high temperature cannot be sufficiently cooled even though there is a level difference in a coolant passage.SOLUTION: In a cooling structure of a semiconductor module including: a semiconductor module mounting first semiconductor elements 12 and second semiconductor elements 11 which have temperature higher than the first semiconductor elements 12 when used; and a cooler 51 which includes therein a passage in which a coolant flows to cool the semiconductor module, one or more of the first semiconductor elements 12 are arranged in a first row in a direction in which the coolant flows, one or more of the second semiconductor elements 11 are arranged in a second row, a joint part between the semiconductor module and the cooler 51 has a narrower passage cross section area of the passage in which the coolant flows by the thickness of the cooler 51 in comparison with a part where the semiconductor module and the cooler 51 are not jointed, and the thickness of at least one of an upper stream and a lower stream of the second row among the thicknesses of the cooler in the joint part is thinner than the thickness of at least one of an upper stream and a lower stream of the first row. |
