发明名称 LAMINATED STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a laminated structure in which an insulating layer has very high thermal conductivity.SOLUTION: A laminated structure 1 includes a thermal conductor 2 having thermal conductivity equal to or greater than 10 W/m K, an insulating layer 3, and a conductive layer 4. The insulating layer 3 is formed by curing an insulating material in a sheet form. The insulating material contains: a polymer whose weight average molecular weight is equal to or more than 10,000; a crystalline compound whose molecular weight is less than 10,000 and having a cyclic ether group; a noncrystalline compound whose molecular weight is less than 10,000 and having a thermosetting functional group; a curing agent; and a filler having thermal conductivity equal to or greater than 10 W/m K. The content of the crystalline compound is equal to or more than 40 wt.% based on the total 100 wt.% of the resin components in the insulating material. The content of the filler is equal to or more than 80 wt.% based on 100 wt.% of the insulating material.
申请公布号 JP2013159098(A) 申请公布日期 2013.08.19
申请号 JP20120025320 申请日期 2012.02.08
申请人 SEKISUI CHEM CO LTD 发明人 KONDO SHUNSUKE;MAENAKA HIROSHI;AOYAMA TAKUJI;NAKAMURA HIDE;WATANABE TAKASHI
分类号 B32B27/20;B32B7/02;B32B27/42 主分类号 B32B27/20
代理机构 代理人
主权项
地址