| 摘要 |
PROBLEM TO BE SOLVED: To achieve compression resin sealing molding using a substrate 1 before resin sealing having a structure having a resin uncontactable area B on a mounting surface side for an LED chip (semiconductor chip) 2 on a semiconductor substrate.SOLUTION: A substrate 1 before resin sealing is set in a lower mold cavity 7c, and a resin uncontactable area B is covered by joining an upper end part 10a of a member 10 for resin burr prevention which projects into the lower mold cavity 7c to respective parts of the resin uncontactable area B of the substrate 1 before resin sealing. In this state, both upper and lower molds 6, 7 are closed and an LED chip 2 on the substrate 1 before resin sealing is dipped in a transparent resin material R in the lower mold cavity 7c. Further, respective LED chips 2 are sealed and molded in a transparent resin molding (lens) by compressing the transparent resin material R in the lower mold cavity 7c, and resin burrs are prevented from sticking on the resin uncontactable area B. |
