| 摘要 |
PROBLEM TO BE SOLVED: To simultaneously separate a plurality of chips, in addition, supply many types of chips, speed up chip assembly, and make a chip supply mechanism compact.SOLUTION: A method for manufacturing a semiconductor device is constituted so that a moving direction of dicing tape 2 which adheres and supports a semiconductor chip 1 and a dicing ring 3 is bent like the inverted U-shape by an edge member 4, in accordance with bending, the ring and the chip are peeled off from the tape, the peeled chip moves onto a base member 6 placed adjacent to the edge member, and then, the chip on the base member is absorbingly held by a chip assembly machine 9, and transferred to a loaded member 7 to be assembled. |
