发明名称 DIE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a die device capable of easily forming holes with a high roundness even when forming the holes adjacent to and close to each other.SOLUTION: A punching member includes a first punching member 10A containing a first cutting edge 11A formed around a first central axis AX1, having a first joint surface 12A formed by cutting along a plane containing an axis parallel with the first central axis, and containing a first shank 13A larger than the first cutting edge in diameter; and a second punching member 10B containing a second cutting edge 11B formed around a second central axis AX2, having a second joint surface 12B formed with a width larger than the first joint surface by cutting along a plane containing an axis parallel with the second central axis, and containing a second shank 13B larger than the second cutting edge in diameter; the first and second punching members being joined by the first joint surface and second joint surface, exposing the second joint surface. A die plate has holes for holding an outer circumferential part of the first shank, an outer circumferential part of the second shank, and the exposed second joint surface.
申请公布号 JP2013158836(A) 申请公布日期 2013.08.19
申请号 JP20120019595 申请日期 2012.02.01
申请人 SEIKO EPSON CORP 发明人 SAKURADA ATSUSHI;SUGAWARA NORIKI;IGARASHI IPPEI
分类号 B26F1/14;B21D28/34;B26F1/00 主分类号 B26F1/14
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