| 摘要 |
PURPOSE: A laser direct structuring composition is provided to simplify process, form patterns and to have effect that laser and conductive seed particles are reacted each other by plating. CONSTITUTION: A laser direct structuring composition comprises 80-95.4 weight% of thermoplastic resin, 0.1-5 weight% of seed former, and 4.5-15 weight% of laser absorbent, and can be plated after being activated after activation. The thermoplastic resin comprises one or more selected from polyester which comprises polypropylene, polyamide, polyethylene terephthalate and polybutylene terephthalate, crosslinked polyethylene terephthalate, liquid crystal polymer, polycarbonate, polyphthalateamide, and polyphenylene oxide. |
