| 摘要 |
PROBLEM TO BE SOLVED: To prevent a conventionally overlooked decrease in strength of a substrate attributable to side machining, and thereby reduce an increase in cracking caused by thinning of a display panel, etc., in a device for performing a grinding process on a cut sideface of a glass substrate by means of a rotary grinding wheel.SOLUTION: Thrust force (positioning force or feed force) in a direction toward a substrate is limited, relating to position setting (positioning or feed) of a grinding wheel for processing a sideface of a substrate. When machining reaction force in an X-axis direction acting on the grinding force exceeds the limited thrust force, the grinding wheel is pushed back in a direction away from the substrate, following the resulting load. When the load falls below the limited thrust force, the grinding wheel returns to an original position as instructed by a controller, and holds the position. |
