| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding device capable of grinding a plurality of different types of wafers under proper grinding conditions according to the types of the wafers when the plurality of wafers are ground.SOLUTION: A grinding device includes chuck tables each having a holding surface for sucking and holding a wafer, grinding means each having a grinding wheel for grinding the wafer sucked and held on the holding surface of the chuck table, grinding feed means each grind-feeding the grinding means in the grinding feed direction perpendicular to the holding surface of the chuck table, and a loading means for loading an un-ground wafer to the holding surface of the chuck table. The grinding device further includes a detection means for detecting the un-ground wafer to be loaded onto the chuck table by the loading means, and a control means for determining the type of the wafer detected by the detection means and selecting the grinding condition according to the type of the determined wafer. |
