| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape for wafer processing, capable of moderately splitting a semiconductor wafer and an adhesive layer upon expanding at a stealth dicing step of splitting the semiconductor wafer and an adhesive layer, or other steps, and a method for manufacturing the same.SOLUTION: A tape for wafer processing includes: a peeling base material forming a base portion of the tape; an adhesive layer provided on one side of the peeling base material corresponding to a planar shape of a semiconductor wafer; a cohesive layer provided so as to cover the adhesive layer; and a base material film provided so as to cover the cohesive layer. In the cohesive layer and the base material film, a region extended to the outside of the adhesive layer is a sticking region to a wafer ring, and a region of the base film overlapping with the adhesive layer includes a plurality of notches formed from an opposite side to the adhesive layer side. |
